Probe card pins with a tapered profile are high-performance parts used for electronic component testing. Pins contact electrode pads on LSI chips and other semiconductor devices during the production process to test for conductivity.
As LSI chips become increasingly integrated, we respond to the demand for smaller diameters and greater precision. Using our experience in grinding technology, we offer a unique taper grinding process that allows us to produce a probe card pin with extremely high tolerances not achievable with conventional etching processes.
Our proprietary process grinds precious metal materials, not suitable for etching, to a high level of accuracy. This creates a taper with superior linearity and variation-free uniformity.
We also manufacture pins bent to application-specific profiles. Requirements including various tip shapes and surface treatments with plating and insulation can also be provided upon request.
We also produce sub-micron (50-µm dia. or less) pins for vertical cards and wire probe pins made of high-speed steel.