TOKUSEN U.S.A., Inc. Silver nano flake offers exceptional properties including a thin, flat, and narrow size distribution, setting it apart from traditional flakes.
Our flakes are created for a range of high-tech applications include:
- Printed circuits: Ideal for solar panels and touch screens, offering superior conductivity and printability.
- Die attach: Effective for electronic device bonding due to excellent sintering properties.
- Conductive ink and paste: Superior dispersibility compared to conventional flakes provides enhanced print quality, printability, and resolution.
- Curing Conditions: 100 °C for 2 minutes.
- Electrical Resistance: 20-25 Ω·cm <film thickness ~1 μm>.
- Other uses: Versatile in pigments, reflective materials, and more.
Ag Nano Flakes
Conventional Flakes
Benefits
- Cost efficiency: In high-speed printing, TOKUSEN U.S.A., Inc.’s silver nano flakes reduce silver film thickness, leading to significant material cost savings.
- Unique Properties: Our nano flakes provide high electrical conductivity across a wide temperature range <100-400 °C> and can be melted at lower temperatures than conventional flakes.
Product line
Here you will see the full TOKUSEN U.S.A., Inc. line of silver nano flake including shape, size, thickness, and sintering temperature.
